IC封装种类 ................................................................................................................................. - 3 -

1、BGA(ball grid array) ...................................................................................................... - 3 -

2、BQFP(quad flat package with bumper) .......................................................................... - 4 -

3、碰焊PGA(butt joint pin grid array) ............................................................................... - 4 -

4、C－(ceramic) .................................................................................................................. - 4 -

5、Cerdip ............................................................................................................................. - 4 -

6、Cerquad .......................................................................................................................... - 5 -

7、CLCC(ceramic leaded chip carrier) ............................................................................... - 5 -

8、COB(chip on board) ....................................................................................................... - 5 -

9、DFP(dual flat package) .................................................................................................. - 6 -

10、DIC(dual in-line ceramic package) .............................................................................. - 6 -

11、DIL(dual in-line) .......................................................................................................... - 6 -

12、DIP(dual in-line package) ............................................................................................ - 6 -

13、DSO(dual small out-lint) .............................................................................................. - 6 -

14、DICP(dual tape carrier package) .................................................................................. - 7 -

15、DIP(dual tape carrier package) ..................................................................................... - 7 -

16、FP(flat package) ........................................................................................................... - 7 -

17、flip-chip ........................................................................................................................ - 7 -

18、FQFP(fine pitch quad flat package) ............................................................................. - 8 -

19、CPAC(globe top pad array carrier) ............................................................................... - 8 -

20、CQFP(quad fiat package with guard ring) ................................................................... - 8 -

21、H-(with heat sink) ........................................................................................................ - 8 -

22、pin grid array(surface mount type) ............................................................................... - 8 -

23、JLCC(J-leaded chip carrier) ......................................................................................... - 9 -

24、LCC(Leadless chip carrier) .......................................................................................... - 9 -

25、LGA(land grid array) ................................................................................................... - 9 -

26、LOC(lead on chip) ..................................................................................................... - 10 -

27、LQFP(low profile quad flat package) ......................................................................... - 10 -

28、L－QUAD .................................................................................................................. - 10 -

29、MCM(multi-chip module) .......................................................................................... - 10 -

30、MFP(mini flat package) ............................................................................................. - 11 -

31、MQFP(metric quad flat package) ............................................................................... - 11 -

32、MQUAD(metal quad) ................................................................................................ - 11 -

33、MSP(mini square package) ........................................................................................ - 12 -

34、OPMAC(over molded pad array carrier) ................................................................... - 12 -

35、P－(plastic) ................................................................................................................ - 12 -

36、PAC(pad array carrier) ............................................................................................... - 12 -

37、PCLP(printed circuit board leadless package) ........................................................... - 12 -

38、PFPF(plastic flat package) ......................................................................................... - 12 -

39、PGA(pin grid array) ................................................................................................... - 13 -

40、piggy back .................................................................................................................. - 13 -

41、PLCC(plastic leaded chip carrier) .............................................................................. - 13 -

42、P－LCC(plastic teadless chip carrier)(plastic leaded chip ......................................... - 14 -

43、QFH(quad flat high package) ..................................................................................... - 14 -